Master the Toughest CVOC Source Zone Challenges
CVOC DNAPL source zones present some of the most persistent obstacles in site cleanup. These sites often involve complex hydrogeology, high contaminant mass, and access limitations beneath active infrastructure. Traditional methods can fall short, leaving you with missed remedial goals, extended timelines, and escalating costs.
Our new four-part webinar series will uncover why in situ thermal remediation (ISTR) consistently delivers results for complex CVOC DNAPL source zones. You will learn how ISTR works, how to design systems for success, and see real-world case studies where thermal technologies achieved aggressive cleanup goals even under the most demanding conditions.
Part 1: Why ISTR Can Be a Good Choice for Remediating CVOC Source Zones – January 28, 2026
Understand what makes CVOC DNAPL source zones so difficult to remediate and why ISTR is uniquely suited to overcome these challenges. We will cover removal mechanisms, the three primary heating technologies (ERH, TCH, SEE), and how to match them to site conditions, contaminants, and access constraints.
Part 2: Designing ISTR Systems That Deliver Results for CVOC Source Zones – February 25, 2026
Learn how to turn a conceptual site model (CSM) into a robust thermal design. We will break down key components such as energy delivery, vapor covers, extraction systems, and monitoring, and show how proper delineation and realistic cleanup goals can save time and money.
Part 3 & 4: Real-World Case Studies – March 25, 2026 | April 22, 2026
See ISTR in action. These two sessions feature diverse projects, from large sites with complex contaminant profiles to source zones beneath active buildings and railroads. Learn how design decisions were made, technologies applied, and performance tracked to achieve stringent remedial objectives.
Don’t miss this opportunity to learn from experts who have designed and implemented hundreds of ISTR projects. Secure your spot today and transform the way you approach source zone remediation.